Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB
