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    請使用永久網址來引用或連結此文件: http://chur.chu.edu.tw/handle/987654321/34915


    題名: Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages
    作者: 任貽明
    Jen, Yi-Ming
    貢獻者: 機械工程學系
    Mechanical Engineering
    關鍵詞: Finite element;FE;method;flip-chip plastic ball grid array;FC-PBGA;lid-substrate adhesive;reliability;thermal cycling test;thermal enhancement;thermal fatigue life;viscoplastic
    Finite element;FE;method;flip-chip plastic ball grid array;FC-PBGA;lid-substrate adhesive;reliability;thermal cycling test;thermal enhancement;thermal fatigue life;viscoplastic
    日期: 2006
    上傳時間: 2014-06-27 03:12:12 (UTC+8)
    摘要: Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB
    Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB
    顯示於類別:[機械工程學系] 期刊論文

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