Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages

Chung-Hua University Repository > 工學院 > 機械工程學系 > 期刊論文 > Item 987654321/34915

jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://chur.chu.edu.tw/handle/987654321/34915

题名:	Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages
作者:	任貽明 Jen, Yi-Ming
贡献者:	機械工程學系 Mechanical Engineering
关键词:	Finite element;FE;method;flip-chip plastic ball grid array;FC-PBGA;lid-substrate adhesive;reliability;thermal cycling test;thermal enhancement;thermal fatigue life;viscoplastic Finite element;FE;method;flip-chip plastic ball grid array;FC-PBGA;lid-substrate adhesive;reliability;thermal cycling test;thermal enhancement;thermal fatigue life;viscoplastic
日期:	2006
上传时间:	2014-06-27 03:12:12 (UTC+8)
摘要:	Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB
显示于类别:	[機械工程學系] 期刊論文

文件中的档案:

档案	描述	大小	格式	浏览次数
p_m211_0317.pdf		28Kb	Adobe PDF	41	检视/开启

在CHUR中所有的数据项都受到原著作权保护.