Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages

CHUR > College of Engineering > Department of Mechanical Engineering > Journal Articles > Item 987654321/34915

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Title:	Effect of Size of Lid-Substrate Adhesive on Reliability of Solder Balls in Thermally Enhanced Flip Chip PBGA Packages
Authors:	任貽明 Jen, Yi-Ming
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Finite element;FE;method;flip-chip plastic ball grid array;FC-PBGA;lid-substrate adhesive;reliability;thermal cycling test;thermal enhancement;thermal fatigue life;viscoplastic Finite element;FE;method;flip-chip plastic ball grid array;FC-PBGA;lid-substrate adhesive;reliability;thermal cycling test;thermal enhancement;thermal fatigue life;viscoplastic
Date:	2006
Issue Date:	2014-06-27 03:12:12 (UTC+8)
Abstract:	Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB Six design cases of lid-substrate adhesive with various combinations of widths and heights were analyzed to investigate how the size of the adhesive affects the reliability of the solder balls of thermally enhanced flip chip plastic ball grid array (FC-PB
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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