Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages

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題名:	Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
作者:	簡錫新 Chien, H. H.
貢獻者:	機械工程學系 Mechanical Engineering
關鍵詞:	fatigue life;reliability;thermally enhanced FC-PBGA package;lid;creep fatigue life;reliability;thermally enhanced FC-PBGA package;lid;creep
日期:	2006
上傳時間:	2014-06-27 03:06:52 (UTC+8)
摘要:	This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lib materials under thermal cycling tests. Three FC-PBGA packages with different lid materia This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lib materials under thermal cycling tests. Three FC-PBGA packages with different lid materia
顯示於類別:	[機械工程學系] 期刊論文

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