| 题名: | Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages |
| 作者: | 簡錫新
Chien, H. H. |
| 贡献者: | 機械工程學系
Mechanical Engineering |
| 关键词: | fatigue life;reliability;thermally enhanced FC-PBGA package;lid;creep
fatigue life;reliability;thermally enhanced FC-PBGA package;lid;creep |
| 日期: | 2006 |
| 上传时间: | 2014-06-27 03:06:52 (UTC+8) |
| 摘要: | This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lib materials under thermal cycling tests. Three FC-PBGA packages with different lid materia
This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array (FC-PBGA) packages with different lib materials under thermal cycling tests. Three FC-PBGA packages with different lid materia |
| 显示于类别: | [機械工程學系] 期刊論文
|
