A FC-BGA family package with thermal performance enhancement, denoted the HFC-BGA package, was adopted to perform the parametric assessment of board-level package reliability. Solder ball fatigue failure is the major studied subject in this research. A 3D A FC-BGA family package with thermal performance enhancement, denoted the HFC-BGA package, was adopted to perform the parametric assessment of board-level package reliability. Solder ball fatigue failure is the major studied subject in this research. A 3D
