Parametric Assessment for Board-Level Solder Ball Reliability of A HFC-BGA Package

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Title:	Parametric Assessment for Board-Level Solder Ball Reliability of A HFC-BGA Package
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	board-level reliability;HFC-BGA;finite element analysis board-level reliability;HFC-BGA;finite element analysis
Date:	2006
Issue Date:	2014-06-27 02:40:55 (UTC+8)
Abstract:	A FC-BGA family package with thermal performance enhancement, denoted the HFC-BGA package, was adopted to perform the parametric assessment of board-level package reliability. Solder ball fatigue failure is the major studied subject in this research. A 3D A FC-BGA family package with thermal performance enhancement, denoted the HFC-BGA package, was adopted to perform the parametric assessment of board-level package reliability. Solder ball fatigue failure is the major studied subject in this research. A 3D
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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