Parametric Assessment for Board-Level Solder Ball Reliability of A HFC-BGA Package

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题名:	Parametric Assessment for Board-Level Solder Ball Reliability of A HFC-BGA Package
作者:	陳精一 Chen, Ching-I
贡献者:	機械工程學系 Mechanical Engineering
关键词:	board-level reliability;HFC-BGA;finite element analysis board-level reliability;HFC-BGA;finite element analysis
日期:	2006
上传时间:	2014-06-27 02:40:55 (UTC+8)
摘要:	A FC-BGA family package with thermal performance enhancement, denoted the HFC-BGA package, was adopted to perform the parametric assessment of board-level package reliability. Solder ball fatigue failure is the major studied subject in this research. A 3D A FC-BGA family package with thermal performance enhancement, denoted the HFC-BGA package, was adopted to perform the parametric assessment of board-level package reliability. Solder ball fatigue failure is the major studied subject in this research. A 3D
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