Chung-Hua University Repository:Item 987654321/39163
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    Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/39163


    Title: Wireless Thermal Bubble Type Accelerometer and Monitor System Design
    Authors: 林君明
    Lin, Jium-Ming
    Contributors: 通訊工程學系
    Communication Engineering
    Keywords: Thermal bubble type accelerometer;Silicon wafer;Thermal conductivity;Flexible substrate, Xenon gas
    Date: 2011
    Issue Date: 2014-07-07 13:54:57 (UTC+8)
    Abstract: Traditional thermal bubble type accelerometers are manufactured on silicon wafers, and consequently, their manufacturing costs are high. Moreover, traditional thermal bubble type accelerometers built on silicon wafers usually use silicon dioxide supports
    Appears in Collections:[Department of Communication Engineering] Teachers Books

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