Capability testing based on subsamples: a case on photolithography process control in wafer fabrication

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题名:	Capability testing based on subsamples: a case on photolithography process control in wafer fabrication
作者:	李欣怡 Lee, Amy Hsin-I
贡献者:	工業管理學系 Industrial Management
关键词:	Photolithography;critical dimension;critical value;alignment accuracy;photoresist thickness;process capability;subsamples Photolithography;critical dimension;critical value;alignment accuracy;photoresist thickness;process capability;subsamples
日期:	2010
上传时间:	2014-06-27 10:37:54 (UTC+8)
摘要:	Photolithography is considered as the bottleneck in semiconductor manufacturing, and a good control of critical dimension, alignment accuracy and photoresist thickness is essential for maintaining a high quality level of wafers. In this study, a photolith Photolithography is considered as the bottleneck in semiconductor manufacturing, and a good control of critical dimension, alignment accuracy and photoresist thickness is essential for maintaining a high quality level of wafers. In this study, a photolith
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