Capability testing based on subsamples: a case on photolithography process control in wafer fabrication

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Title:	Capability testing based on subsamples: a case on photolithography process control in wafer fabrication
Authors:	李欣怡 Lee, Amy Hsin-I
Contributors:	工業管理學系 Industrial Management
Keywords:	Photolithography;critical dimension;critical value;alignment accuracy;photoresist thickness;process capability;subsamples Photolithography;critical dimension;critical value;alignment accuracy;photoresist thickness;process capability;subsamples
Date:	2010
Issue Date:	2014-06-27 10:37:54 (UTC+8)
Abstract:	Photolithography is considered as the bottleneck in semiconductor manufacturing, and a good control of critical dimension, alignment accuracy and photoresist thickness is essential for maintaining a high quality level of wafers. In this study, a photolith Photolithography is considered as the bottleneck in semiconductor manufacturing, and a good control of critical dimension, alignment accuracy and photoresist thickness is essential for maintaining a high quality level of wafers. In this study, a photolith
Appears in Collections:	[Industrial Management] Journal Articles

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