Solder reliability assessments are performed in this research using a 3-D equivalent global model and local submodeling technique. The equivalent global model is capable of addressing cirtical solder failure locations. The local solder ball and bump submo Solder reliability assessments are performed in this research using a 3-D equivalent global model and local submodeling technique. The equivalent global model is capable of addressing cirtical solder failure locations. The local solder ball and bump submo
