Experimental and Numerical Investigations on Solder Reliability for Flip-Chip BGA Packaging

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Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34742

Title:	Experimental and Numerical Investigations on Solder Reliability for Flip-Chip BGA Packaging
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	solder reliability;flip-chip BGA package;fatigue life solder reliability;flip-chip BGA package;fatigue life
Date:	2008
Issue Date:	2014-06-27 03:02:34 (UTC+8)
Abstract:	Solder reliability assessments are performed in this research using a 3-D equivalent global model and local submodeling technique. The equivalent global model is capable of addressing cirtical solder failure locations. The local solder ball and bump submo Solder reliability assessments are performed in this research using a 3-D equivalent global model and local submodeling technique. The equivalent global model is capable of addressing cirtical solder failure locations. The local solder ball and bump submo
Appears in Collections:	[Department of Mechanical Engineering] Seminar papers

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