| 題名: | Tensile Test Behavior of the Eutectic Sn-Ag Solder Joint in Ball Grid Array Assemblies |
| 作者: | 葉明勳
Ming-Shyun, Yeh |
| 貢獻者: | 機械工程學系
Mechanical Engineering |
| 關鍵詞: | Sn-3Ag-0;5Cu solder;ball-grid array assembly;tensile test behaviors;homologous temperatures;transgranular fracture
Sn-3Ag-0;5Cu solder;ball-grid array assembly;tensile test behaviors;homologous temperatures;transgranular fracture |
| 日期: | 2004 |
| 上傳時間: | 2014-06-27 03:01:02 (UTC+8) |
| 摘要: | The mechanical behavior of a Sn-3Ag-0.5Cu ball-grid array assembly was evaluated by tensile testing at a strain rate of 10-3 s-1 at various homologous temperatures in this study. The maximum stress of the Sn-3Ag-0.5Cu ball-grid array assembly decreased as
The mechanical behavior of a Sn-3Ag-0.5Cu ball-grid array assembly was evaluated by tensile testing at a strain rate of 10-3 s-1 at various homologous temperatures in this study. The maximum stress of the Sn-3Ag-0.5Cu ball-grid array assembly decreased as |
| 顯示於類別: | [機械工程學系] 期刊論文
|
