Chung-Hua University Repository:Item 987654321/34713
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 8557/14866 (58%)
Visitors : 2375422      Online Users : 1900
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
    •  Adv. Search
    Home ‧ Login ‧ Upload ‧ Help ‧ About ‧ Administer Goto mobile version


    Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34713


    Title: Tensile Test Behavior of the Eutectic Sn-Ag Solder Joint in Ball Grid Array Assemblies
    Authors: 葉明勳
    Ming-Shyun, Yeh
    Contributors: 機械工程學系
    Mechanical Engineering
    Keywords: Sn-3Ag-0;5Cu solder;ball-grid array assembly;tensile test behaviors;homologous temperatures;transgranular fracture
    Sn-3Ag-0;5Cu solder;ball-grid array assembly;tensile test behaviors;homologous temperatures;transgranular fracture
    Date: 2004
    Issue Date: 2014-06-27 03:01:02 (UTC+8)
    Abstract: The mechanical behavior of a Sn-3Ag-0.5Cu ball-grid array assembly was evaluated by tensile testing at a strain rate of 10-3 s-1 at various homologous temperatures in this study. The maximum stress of the Sn-3Ag-0.5Cu ball-grid array assembly decreased as
    The mechanical behavior of a Sn-3Ag-0.5Cu ball-grid array assembly was evaluated by tensile testing at a strain rate of 10-3 s-1 at various homologous temperatures in this study. The maximum stress of the Sn-3Ag-0.5Cu ball-grid array assembly decreased as
    Appears in Collections:[Department of Mechanical Engineering] Journal Articles

    Files in This Item:

    File Description SizeFormat
    p_m211_0245.pdf26KbAdobe PDF97View/Open


    All items in CHUR are protected by copyright, with all rights reserved.

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©  2006-2025  - Feedback