Due to the high speed and high I/O count for semiconductor package requirements, thousands of soldered interconnections are indispensable, and this situation renders the traditional finite element method (FEM) analysis a formidable challenge. This paper p Due to the high speed and high I/O count for semiconductor package requirements, thousands of soldered interconnections are indispensable, and this situation renders the traditional finite element method (FEM) analysis a formidable challenge. This paper p
