Global-to-Local Modeling and Experiment Investigation of a HFCBGA Package Board-level Solder Joint Reliability

CHUR > College of Engineering > Department of Mechanical Engineering > Journal Articles > Item 987654321/34169

Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34169

Title:	Global-to-Local Modeling and Experiment Investigation of a HFCBGA Package Board-level Solder Joint Reliability
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Finite element method;HFCBGA package;solder joint reliability;fatigue life Finite element method;HFCBGA package;solder joint reliability;fatigue life
Date:	2007
Issue Date:	2014-06-27 02:41:08 (UTC+8)
Abstract:	Due to the high speed and high I/O count for semiconductor package requirements, thousands of soldered interconnections are indispensable, and this situation renders the traditional finite element method (FEM) analysis a formidable challenge. This paper p Due to the high speed and high I/O count for semiconductor package requirements, thousands of soldered interconnections are indispensable, and this situation renders the traditional finite element method (FEM) analysis a formidable challenge. This paper p
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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