Experiment and Simulation in Design of the Board-Level Drop
Testing Tower Apparatus

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题名:	Experiment and Simulation in Design of the Board-Level Drop Testing Tower Apparatus
作者:	陳精一 Chen, Ching-I
贡献者:	機械工程學系 Mechanical Engineering
关键词:	JESD22-B111;Drop Test;Impact Shock;Peak
日期:	2012
上传时间:	2014-06-27 02:39:16 (UTC+8)
摘要:	Solder joint reliability is of great concern to semiconductor and electronic product manufacturers. Due to rapid advancements in the electronic industry, packages with fine pitch ball grid array have been increasingly used in portable electronic devices.
显示于类别:	[機械工程學系] 期刊論文

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