Chung-Hua University Repository:Item 987654321/34094
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    Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34094


    Title: Experiment and Simulation in Design of the Board-Level Drop Testing Tower Apparatus
    Authors: 陳精一
    Chen, Ching-I
    Contributors: 機械工程學系
    Mechanical Engineering
    Keywords: JESD22-B111;Drop Test;Impact Shock;Peak
    Date: 2012
    Issue Date: 2014-06-27 02:39:16 (UTC+8)
    Abstract: Solder joint reliability is of great concern to semiconductor and electronic
    product manufacturers. Due to rapid advancements in the electronic industry,
    packages with fine pitch ball grid array have been increasingly used in portable
    electronic devices.
    Appears in Collections:[Department of Mechanical Engineering] Journal Articles

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