Chung-Hua University Repository:Item 987654321/36357
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    Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/36357


    Title: Optimization of reflow soldering process for BGA packages by artificial neural network
    Authors: 鄧維兆
    Deng, Wei-Jaw
    Contributors: 餐旅管理學系
    Hospitality Management
    Keywords: BGA;Reflow profiling;Artificial neural network;Optimization;ANOVA
    Date: 2007
    Issue Date: 2014-06-27 15:03:04 (UTC+8)
    Abstract: Purpose - This investigation applied a hybrid method combining a trained artificial neural network (ANN) and the Sequential Quadratic Programming (SQP) method to determine an optimal parameter setting for a reflow soldering process of ball grid array (BGA
    Appears in Collections:[Department of Hospitality Management] Journal Articles

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