This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array(FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid material This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array(FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid material
