| 題名: | Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages |
| 作者: | 任貽明
Jen, Yi-Ming |
| 貢獻者: | 機械工程學系
Mechanical Engineering |
| 關鍵詞: | Fatigue life;reliability;thermally enhanced FC-PBGA package;lid;creep
Fatigue life;reliability;thermally enhanced FC-PBGA package;lid;creep |
| 日期: | 2006 |
| 上傳時間: | 2014-06-27 03:12:25 (UTC+8) |
| 摘要: | This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array(FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid material
This research studied the thermal fatigue life for eutectic solder balls of thermally enhanced flip-chip plastic ball grid array(FC-PBGA) packages with different lid materials under thermal cycling tests. Three FC-PBGA packages with different lid material |
| 顯示於類別: | [機械工程學系] 期刊論文
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