This paper proposes a method for assessing the mechanical reliability assessments and design opinnizatloil of a stacked module package (‘SIP). Two geometrical parameters—-the flip—chip c/ic thickness and the substrate thickness, and three material paramet This paper proposes a method for assessing the mechanical reliability assessments and design opinnizatloil of a stacked module package (‘SIP). Two geometrical parameters—-the flip—chip c/ic thickness and the substrate thickness, and three material paramet
