Chung-Hua University Repository:Item 987654321/34699
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 8557/14866 (58%)
Visitors : 1402835      Online Users : 2645
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
    •  Adv. Search
    Home ‧ Login ‧ Upload ‧ Help ‧ About ‧ Administer Goto mobile version


    Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34699


    Title: Mechanical Behavior of Sn-3Ag-0.5Cu Ball Grid Array Assemblies at Elevated Temperatures
    Authors: 葉明勳
    Ming-Shyun, Yeh
    Contributors: 機械工程學系
    Mechanical Engineering
    Keywords: Sn-15In-2;8Ag solder;ball-grid array assembly;IR reflow process;intermetallic layer;creep fracture
    Date: 2008
    Issue Date: 2014-06-27 03:00:36 (UTC+8)
    Abstract: The mechanical behavior of a ternary Sn-15In-2.8Ag ball-grid array assembly was evaluated at ambient and elevated temperatures. The maximum stress of the Sn-15In-2.8Ag ball-grid array assembly decreased as the temperatures increased and the strain rat
    Appears in Collections:[Department of Mechanical Engineering] Journal Articles

    Files in This Item:

    File Description SizeFormat
    p_m211_0243.pdf27KbAdobe PDF71View/Open


    All items in CHUR are protected by copyright, with all rights reserved.

    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback