| 题名: | Mechanical Properties of Ternary Sn-In-Ag BAll-Grid Array Assemblies at Ambient and Elevated Temperatures |
| 作者: | 葉明勳
Ming-Shyun, Yeh |
| 贡献者: | 機械工程學系
Mechanical Engineering |
| 关键词: | Sn-15In-2;8Ag solder;ball-grid array assembly;IR reflow process |
| 日期: | 2009 |
| 上传时间: | 2014-06-27 03:00:23 (UTC+8) |
| 摘要: | The mechanical behavior of a ternary Sn-15In-2.8Ag ball-grid array assembly was evaluated at ambient and elevated temperatures. The maximum stress of the Sn-15In-2.8Ag ball-grid array assembly decreased as the temperatures increased and the strain rates d |
| 显示于类别: | [Department of Mechanical Engineering] Journal Articles
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