Recipe Optimization and Design Software Development of Tape Carrier Package (TCP) Inner Lead Bonding (ILB)

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Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34137

Title:	Recipe Optimization and Design Software Development of Tape Carrier Package (TCP) Inner Lead Bonding (ILB)
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Bonding recipe;inner lead bonding;ILB;tape carrier package;TCP Bonding recipe;inner lead bonding;ILB;tape carrier package;TCP
Date:	2005
Issue Date:	2014-06-27 02:40:29 (UTC+8)
Abstract:	This paper proposes an optimization methodology for quickly determining a bonding recipe for the inner lead bonding (ILB) of a tape carrier package (TCP). The recipe consists of the bonding force, stage temperature, bonding time, and geometrical forming. This paper proposes an optimization methodology for quickly determining a bonding recipe for the inner lead bonding (ILB) of a tape carrier package (TCP). The recipe consists of the bonding force, stage temperature, bonding time, and geometrical forming.
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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