Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly

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Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34126

Title:	Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	GPU;fan-sink cooling module;mounting mechanism;finite element analysis;thermal resistance;TIM;retention GPU;fan-sink cooling module;mounting mechanism;finite element analysis;thermal resistance;TIM;retention
Date:	2007
Issue Date:	2014-06-27 02:40:14 (UTC+8)
Abstract:	Three approaches for measuring clamping force, retention design optimization and thermal performance validation are proposed to optimize the a GPU fan-sink cooling module assembly. A GPU test vehicle is designed for mechanical characterization and thermal Three approaches for measuring clamping force, retention design optimization and thermal performance validation are proposed to optimize the a GPU fan-sink cooling module assembly. A GPU test vehicle is designed for mechanical characterization and thermal
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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