Abstract—Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape andAu bumps on a driver IC chip to form electrical paths.With the newly developed film carrier assembly technology, called chip on film (COF), Abstract—Inner lead bonding (ILB) is used to thermomechanically join the Cu inner leads on a flexible film tape andAu bumps on a driver IC chip to form electrical paths.With the newly developed film carrier assembly technology, called chip on film (COF),
