THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS

CHUR > College of Engineering > Department of Mechanical Engineering > Journal Articles > Item 987654321/34103

Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/34103

Title:	THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS
Authors:	陳精一 Chen, Ching-I
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	TIM;flip-chip TIM;flip-chip
Date:	2008
Issue Date:	2014-06-27 02:39:33 (UTC+8)
Abstract:	Thermal management has become an increasingly important issue in the semiconductor industry. One aspect of the thermal management system is the efficient transfer of heat from flip-chip packages. And effective thermal interface material (TIM) is crucial w Thermal management has become an increasingly important issue in the semiconductor industry. One aspect of the thermal management system is the efficient transfer of heat from flip-chip packages. And effective thermal interface material (TIM) is crucial w
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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