The multiple zoom-in modeling technique is used to investigate the stress cracking and voiding at the via and low-K delamination between a Cu metal trace and low-K dielectric. The die thickness, substrate body size, BT core thickness, through hole density The multiple zoom-in modeling technique is used to investigate the stress cracking and voiding at the via and low-K delamination between a Cu metal trace and low-K dielectric. The die thickness, substrate body size, BT core thickness, through hole density
