The Feature Extraction and Analysis of Flaw Detection and Classification in BGA Gold-Plating Areas

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Title:	The Feature Extraction and Analysis of Flaw Detection and Classification in BGA Gold-Plating Areas
Authors:	邱奕契 Chiou, Yih-Chih
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	BGA;Color Image Segmentation;Neural Network;Flaw Detection/Classification BGA;Color Image Segmentation;Neural Network;Flaw Detection/Classification
Date:	2008
Issue Date:	2014-06-27 02:38:20 (UTC+8)
Abstract:	The color change on a bond finger or ball pad usually indicates an anomaly occurs in the bond finger or ball pad. For example, a scratch on the bond finger may exposure nickel underneath and cause the change of color. Accordingly, the research of flaw det The color change on a bond finger or ball pad usually indicates an anomaly occurs in the bond finger or ball pad. For example, a scratch on the bond finger may exposure nickel underneath and cause the change of color. Accordingly, the research of flaw det
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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