Micro Crack Detection of Multi-Crystalline Silicon Solar Wafer Using Machine Vision Techniques

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Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/33965

Title:	Micro Crack Detection of Multi-Crystalline Silicon Solar Wafer Using Machine Vision Techniques
Authors:	邱奕契 Chiou, Yih-Chih
Contributors:	機械工程學系 Mechanical Engineering
Keywords:	Micro Crack;Flaw Detection;Region Growing;Solar Wafer;NIR Imaging
Date:	2011
Issue Date:	2014-06-27 02:35:36 (UTC+8)
Abstract:	It is not easy to detect invisible micro cracks of multi-crystalline silicon solar wafers because of their heterogeneously textured backgrounds. The difficulty is twofold. First, invisible micro cracks must be visualized to imaging devices. Second, an ima
Appears in Collections:	[Department of Mechanical Engineering] Journal Articles

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