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    Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/29694


    Title: 利用類神經網路建構晶圓允收測試電性Vt預測模型
    Authors: 李友錚
    Lee, Yu-Cheng
    Contributors: 科技管理學系
    Technology Management
    Keywords: 類神經網路;迴歸分析;倒傳遞類神經網路;逐步選取法。
    Date: 2013
    Issue Date: 2014-06-27 00:35:53 (UTC+8)
    Abstract: 晶圓代工是目前台灣半導體製造產業主要的生產方式，晶圓良率的高低是半導體產業能否獲利的重要關鍵指標，近年來半導體生產科技的進步，讓晶圓生產的尺寸增大與數量增多，半導體生產技術的改進，晶圓加工的複雜度隨著製程越精密而且增加，這使得製程參數變得難以掌控，目前大部分的晶圓代工廠仍然是使用統計製程管制的技術來監控製程參數，來提高製程的穩定性和改善製程良率，晶圓允收測試(Wafer Acceptance Test，WAT)測試結果，影響晶圓的良率，因此建立WAT 測試結果中測試電性Vt(Vt 中文稱為起始電壓或臨界電
    Appears in Collections:[Department of Technology Management] Seminar Papers

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