Shop Floor Control Model for Wafer Fabrication and Flip Chip

CHUR > College of Management > Industrial Management > Seminar Papers > Item 987654321/29039

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Title:	Shop Floor Control Model for Wafer Fabrication and Flip Chip
Authors:	杜瑩美 Tu, Ying Mei
Contributors:	工業管理學系 Industrial Management
Keywords:	Wafer fabrication;Flip-chip package;Shop floor control;Dynamic buffer management;DBR scheduling
Date:	2011
Issue Date:	2014-06-27 00:16:07 (UTC+8)
Abstract:	Semiconductor manufacturing is a capital and technology intensive high-tech industry with complex processes. As the technology evolution, to satisfy the high pin-count and performance requirements, flip-chip became the predominant technology for chip-to-n
Appears in Collections:	[Industrial Management] Seminar Papers

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