Chung-Hua University Repository:Item 987654321/28466
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    CHUR > College of Management > Industrial Management > Seminar Papers >  Item 987654321/28466


    Please use this identifier to cite or link to this item: http://chur.chu.edu.tw/handle/987654321/28466


    Title: 現行封裝廠之接單模式與生產管理方法探討
    Authors: 吳鴻輝
    Wu, Horng-Huei
    Contributors: 工業管理學系
    Industrial Management
    Keywords: 封裝廠;接單式生產
    Date: 2005
    Issue Date: 2014-06-26 23:59:49 (UTC+8)
    Abstract: 半導體封裝廠通常均以接單式生產的代工服務為主，業者投資機器設備再出售機台產能，如此的經營模式較接近服務業的角色，故提供滿足客戶需求如縮短生產週期和準確的交期即為其主要目標之一。本研究彙總各學者的研究成果，並針對實務上封裝廠的製程、生產管理特性和現況作分析，作為提供後續研究的參考。
    Appears in Collections:[Industrial Management] Seminar Papers

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